dewetting

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الإنجليزية - التركية
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الإنجليزية - الإنجليزية
Dewetting occurs when molten solder has coated a surface and then receded, leaving mounds of solder that are irregularly shaped and are separated by areas covered with a thin solder film
A situation where a lead or pad was at one point in the soldering process wetted by the solder, but due to extended time or temperature, the presence of intermetallics, volatiles or other causes, has become withdrawn from the wetted surface
Occurrence during soldering, where an initial bond is formed, followed by a withdrawal of solder from the joint, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film Base metal is not exposed